- Software functional testing fully simulates actual system usage
- Saves money by fixing bugs earlier in the software lifecycle
- Captures assembly manufacturing defects or defective components
- Traceability back to operator and component level
- Provides assurance when you receive your board it is fully functioning as it was intended
In Circuit Programming
In Circuit Programming is a technique where a programmable device is programmed after the device is placed on a printed circuit board. It is now the preferred downloading method allowing programming and final debugging in the hardware prior to Functional Test.
HiPot Safety Testing (Electrical Safety Flash Testing)
HiPot testing has long been a standard procedure for assuring the electrical safety compliance of electronic equipment and is a direct application of a high voltage to a unit under test. The test voltage is usually much higher than the usual operating voltage in order to stress the dielectric properties of the device under test. The test will check leakage current is within the test parameters and the assembly is safe.
Fault Finding to Component Level
Should your assembly fail in the field and require fault finding, we have a full suite of scopes, meters. Tools and Equipment which allows us to fault find down to component level.
We will collect and analyse failure data, locate the fault, determine and remove the cause, rectify the fault, inspect and re-test. We will also provide a report identifying the root cause and what preventative action is required.
Automated Optical Inspection is an automated visual inspection of printed circuit board assembly where a camera autonomously scans the assembled components to ensure the board is manufactured correctly.
The AOI process will check for, lifted leads, missing and misaligned components, open circuits, solder bridges, solder shorts, insufficient and excess solder etc.
Every PCB Assembly that has gone through our SMT machines is subjected to an AOI test so you can be sure each board has been 100% verified prior to moving onto the next operation.
The AOI process will check for, lifted leads, missing and misaligned components, open circuits, solder bridges, solder shorts, insufficient and excess solder and correct values and polarity.
At Microtech Electronics all of our products are inspected to IPC-A-610 standards.
IPC-J-STD-001H is recognized globally for its criteria on soldering processes and materials. J-STD-001 is developed in synergy with IPC-A-610 and at Microtech all of our operators are trained to this IPC-A-610 Class 3, which is the highest class and typically used in Aerospace, Automotive, Medical and Defence industries.
We also have IPC trainers on site who are continually looking how to improve process parameters and product quality. They are also fundamental to our Continuous Improvement and Lean Manufacturing methodology.
At Microtech we pride ourselves on our Product Quality so whatever your Test requirements are, please get in contact so we can discuss your product and how it can be manufactured and shipped to the highest standards.